Thin Film Stress

Key Works

• “Stress stability and thermo-mechanical properties of reactively sputtered alumina films,” M.P. Hughey, R.F. Cook and J. Thurn, J. Mat. Sci. 40 (2005) 6345-6355.
• “Stress development kinetics in plasma-enhanced chemical vapor deposited silicon nitride films,” M.P. Hughey and R.F Cook, J. Appl. Phys. 97 (2005) 114914-114923.
• “Stress-Hysteresis During Thermal Cycling of Plasma-Enhanced Chemical Vapor Deposited Silicon Oxide Films,” J. Thurn and R.F. Cook, J. Appl. Phys. 91 (2002) 1988-1992.

Topical Works

• “Stress hysteresis and mechanical properties of plasma-enhanced chemical vapor deposited dielectric films,” J. Thurn, R.F. Cook, M. Kamarajuggada, S.P. Bozeman and L.C. Stearns, J. Appl. Phys. 95 (2004) 967-976.
• “Massive stress changes in PECVD films on thermal cycling,” M.P. Hughey and R.F. Cook, Thin Solid Films 460 (1-2) (2004) 7-16.
• “Mechanical and thermal properties of physical vapor deposited alumina films: I, thermal stability,” J. Thurn and R.F. Cook, J. Mat. Sci. 39 (2004) 4799-4807.
• “Mechanical and thermal properties of physical vapor deposited alumina films: II, elastic, plastic, fracture and adhesive behavior,” J. Thurn and R.F. Cook, J. Mat. Sci. 39 (2004) 4809-4819.
• “Hydrogen diffusion as the rate-limiting mechanism of stress development in plasma-enhanced chemical vapor deposited films,” M.P. Hughey and R.F. Cook, Appl. Phys. Letters 85 (2004) 404-406.
• “Influence of Deposition Conditions on Mechanical Properties of LPCVD Low-Stress Silicon Nitride Films,” Y.A. Toivola, J. Thurn, R.F. Cook, K.G. Roberts and G. Cibuzar, J. Appl. Phys., 94 (2003) 6915-6922.
• (Invited) “Mechanisms Active During Fracture Under Constraint,” R.F. Cook and Z. Suo, MRS Bulletin 27 (2002) 45-51.
• “Chemical vapor deposition of an aluminum nitride-diamond composite in a Triple Torch Plasma Reactor,” M. Asmann, R.F. Cook, J.V. Heberlein and E. Pfender, J. Mater. Res., 16 (2001) 469-477